About the job
Etched develops AI inference systems optimized for transformer architectures. The company’s ASIC technology is designed to deliver significantly higher performance and lower latency than traditional solutions, supporting applications like real-time video generation and parallel reasoning agents. Etched is backed by major venture capital firms and led by an experienced engineering team.
Role overview
The Advanced IC Packaging Team in San Jose is seeking a Thermo-Mechanical & CFD Simulation Engineering Intern. This internship centers on Chip-on-Wafer-on-Substrate (CoWoS) package development for high-performance computing systems. The role involves hands-on simulation work using ANSYS Mechanical APDL and ANSYS FLUENT.
What you will do
- Create Finite Element Analysis (FEA) models for CoWoS integrated circuit packages in ANSYS Mechanical APDL.
- Conduct thermo-mechanical stress and strain analyses, including thermal cycling simulations.
- Evaluate package warpage, solder joint reliability, and interconnect stress.
- Develop Computational Fluid Dynamics (CFD) models in ANSYS FLUENT to simulate solder reflow.
- Collaborate with design engineering teams throughout package development.

