companyEtched logo

Thermo-Mechanical & CFD Simulation Engineering Intern

EtchedSan Jose
On-site Full-time

Clicking Apply Now takes you to AutoApply where you can tailor your resume and apply.


Unlock Your Potential

Generate Job-Optimized Resume

One Click And Our AI Optimizes Your Resume to Match The Job Description.

Is Your Resume Optimized For This Role?

Find Out If You're Highlighting The Right Skills And Fix What's Missing

Experience Level

Entry Level

Qualifications

You Might Be an Ideal Candidate If You HaveEducation & ExperiencePursuing a degree in Mechanical Engineering or a closely related field. Demonstrated academic or project experience with FEA/CFD tools and methodologies. Technical SkillsProficiency in SOLIDWORKS, NX, ANSYS Mechanical APDL, and ANSYS FLUENT. Solid understanding of semiconductor packaging materials and associated processes. Strong knowledge of non-linear material properties (elastic-plastic, viscoelastic). Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts. Basic programming and scripting skills (e.g., APDL, Python, MATLAB).

About the job

Etched develops AI inference systems optimized for transformer architectures. The company’s ASIC technology is designed to deliver significantly higher performance and lower latency than traditional solutions, supporting applications like real-time video generation and parallel reasoning agents. Etched is backed by major venture capital firms and led by an experienced engineering team.

Role overview

The Advanced IC Packaging Team in San Jose is seeking a Thermo-Mechanical & CFD Simulation Engineering Intern. This internship centers on Chip-on-Wafer-on-Substrate (CoWoS) package development for high-performance computing systems. The role involves hands-on simulation work using ANSYS Mechanical APDL and ANSYS FLUENT.

What you will do

  • Create Finite Element Analysis (FEA) models for CoWoS integrated circuit packages in ANSYS Mechanical APDL.
  • Conduct thermo-mechanical stress and strain analyses, including thermal cycling simulations.
  • Evaluate package warpage, solder joint reliability, and interconnect stress.
  • Develop Computational Fluid Dynamics (CFD) models in ANSYS FLUENT to simulate solder reflow.
  • Collaborate with design engineering teams throughout package development.

About Etched

Etched is redefining the landscape of AI technology with innovative solutions that dramatically enhance performance and efficiency. Our commitment to excellence and cutting-edge engineering propels us to the forefront of the semiconductor industry, making us an exciting place for ambitious professionals eager to make an impact.

Similar jobs

Tailoring 0 resumes

We'll move completed jobs to Ready to Apply automatically.