About the job
At HyperLight, we are pioneering the commercialization of thin-film lithium niobate (TFLN) integrated photonics, a groundbreaking material and process technology that is revolutionizing high-performance, scalable optical components for AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and more. Established in 2018, and supported by top-tier venture capital, our dedicated team is focused on the practical mass deployment of TFLN photonics technology.
Central to our operations is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. This platform offers an exceptional blend of performance and industrial readiness, enabling system developers to deploy the technology rapidly across various applications. We collaborate closely with our customers and suppliers, guiding them from the initial conceptualization and design stages through prototyping and mass production, ensuring efficient deployment of TFLN photonic technology.
We believe our platform represents a pivotal advancement in the golden age of integrated photonics, empowering humanity to reach new heights. Our world-class team, comprising experts in engineering, business, and operations, thrives on challenges and shares a commitment to excellence, integrity, innovation, and collaborative problem-solving. We are proud to address complex challenges with curiosity, humility, and a mutual respect for one another.
As we continue to grow, our Packaged Modulator Business Unit is seeking a Product Engineer, Test & Measurement. This role presents a unique opportunity to spearhead the development of new products within our integrated photonics platform. You will be responsible for designing next-generation, high-speed, high-performance TFLN products, leading R&D efforts to enhance product performance, collaborating with customers and vendors to shape product specifications, and spearheading customer engagement initiatives.

