About the job
Job Title: Principal Engineer, Signal Integrity and Power Integrity
Office Location: San Jose, CA
Work Model: Onsite
About SK hynix America
At SK hynix America, we are pioneers in semiconductor innovation, leading the development of advanced memory solutions that power a wide array of devices, from smartphones to data centers. As a global frontrunner in DRAM and NAND flash technologies, we are driving the evolution of mobile technology, enhancing cloud computing capabilities, and exploring future technologies. Our state-of-the-art memory technologies are crucial for the most advanced electronic devices and IT infrastructures, providing improved performance and superior user experiences across the digital realm.
We invite visionary minds to join our mission of shaping the future of technology. Here at SK hynix America, you will collaborate with a team dedicated to pioneering advanced memory solutions while upholding a strong commitment to sustainability. We are not merely responding to technological advancements; we are leading them through significant investments in artificial intelligence, machine learning, and environmentally friendly practices. As we expand our market influence and redefine the boundaries of semiconductor technology, we welcome you to be a part of our journey in creating the next generation of memory solutions that will shape the future of computing.
Job Summary:
SK hynix America is on the lookout for a Principal Engineer to spearhead the Signal Integrity and Power Integrity (SIPI) strategy for cutting-edge advanced packaging technologies. In this role, you will be responsible for the design, analysis, and validation of next-generation advanced packaging solutions for HBM and beyond, including logic-memory integration. This position requires extensive technical expertise in high-speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced packaging.
Responsibilities:
- Strategic Leadership: Define and manage the SIPI roadmap for advanced packaging families, ensuring alignment of technical direction with product and business objectives.
- Architecture & Design: Lead the development of high-performance SiP architectures (HBM, interposer, 3D stacks) and validate power delivery and signal integrity throughout the entire stack—from silicon to substrate.
- Methodology Development: Innovate and disseminate best-practice SIPI methodologies, including electromagnetic extraction, multi-port S-parameter modeling, and power-network analysis for complex packaging environments.
- Technical Ownership: Supervise the complete design flow (package definition, simulation, and validation).

