About the job
Solidigm is on the lookout for a forward-thinking Package Developer to spearhead the exploration and advancement of packaging technologies for Solid State Drives (SSDs) and NAND flash storage card applications. In this pivotal role, you will innovate packaging technologies that align with the SSD product roadmap. Your responsibilities will encompass the design and development of package structures, which include package stack-up and configuration, substrate design, design collaterals, package pin assignments, signal integrity simulations, and liaising with internal and external standards forums. Furthermore, you will lead the tracking of package design milestones, integrate product requirements into packaging solutions, troubleshoot packaging design challenges, and communicate design progress effectively.
- Conduct die fit analysis, stack-up, reference plane, and power distribution assessments for multi-die NAND packages.
- Define device package pin-out and I/O bus interface specifications.
- Integrate high-speed electrical signaling design requirements, high-volume assembly design rules, and emerging IC packaging techniques into your projects.
- Perform package and/or PCB routing studies to analyze cost-performance trade-offs.
- Design, analyze, and validate off-silicon platform interconnects, focusing on memory interfaces like DDR2 and high-speed differential I/O interfaces such as SATA or PCIe.
- Develop electrical modeling capabilities and analysis techniques for busses and interconnects.
- Collaborate with subcontractors to advance packaging design rules aligned with the product roadmap.

