About the job
Senior Signal Integrity Engineer – 1.6T OSFP Board Design
Join us in Bengaluru, Karnataka, India for an exciting opportunity at Lumilens.
About Lumilens
At Lumilens, we are pioneering the essential photonics infrastructure that will drive the future of AI supercomputing. Our innovations range from chip-to-chip optical interconnects to scalable photonic engines, ushering in a new era of computing efficiency, speed, and thermal management.
As a well-funded startup, supported by Mayfield and led by industry veterans, we are not just innovating incrementally; we are redefining the optical layer from the silicon level upwards. Collaborate with a team of elite engineers, tackling some of the most complex challenges in optics and systems engineering. Your contributions will directly shape the infrastructure of tomorrow.
If you are seeking a mission-driven environment with momentum and the opportunity to make a significant impact, we invite you to join our journey.
Role Overview
We are in search of a Senior Signal Integrity Engineer with 15-20 years of expertise to oversee board-level high-speed electrical design and validation for 1.6T DR8 (200G/lane) OSFP optical modules. This role includes providing technical leadership across multiple projects and mentoring our Signal Integrity team.
Key Responsibilities:
- Develop and manage the SI/PI architecture and strategy for the 1.6T DR8 OSFP modules, including defining channel budgets, interface architectures, and design rules for 200G PAM4 lanes from ASIC/DSP to front-panel.
- Lead pre- and post-layout SI/PI simulations and reviews (S-parameters, eye/PAM4 analysis, COM, crosstalk, jitter, PDN impedance) and sign-off on multi-lane channels on high-density module PCBs.
- Specify PCB stack-ups, material choices (e.g., ultra-low-loss laminates), via and breakout strategies, connector selections, and routing guidelines to achieve performance, cost, and manufacturability targets.
- Drive cross-functional technical decisions with hardware, optics, mechanical, firmware, and test teams, ensuring a balance between SI/PI requirements and thermal, mechanical, and system constraints.
- Lead lab correlation and validation plans, including fixture/board design, TDR/VNA/BERT/oscilloscope measurements, de-embedding strategies, and establishing sign-off criteria for engineering benchmarks.

