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Advanced Package Design Engineer

SK hynix AmericaSan Jose, CA
On-site Full-time $110K/yr - $155K/yr

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Experience Level

Experience

Qualifications

Bachelor’s or Master’s degree in Electrical Engineering (preferred), Mechanical Engineering, or a related field. Proficiency in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, and Siemens Xpedition. Strong analytical skills and experience in design optimization. Excellent collaboration and communication skills. Ability to work in a fast-paced, team-oriented environment.

About the job

Job Title: Advanced Package Design Engineer
Office Location: San Jose, CA
Work Model: Onsite

 

About SK hynix America

At SK hynix America, we are leading the charge in semiconductor innovation, delivering cutting-edge memory solutions that drive the functionality of everything from smartphones to expansive data centers. As a global frontrunner in DRAM and NAND flash technologies, we are at the forefront of mobile technology evolution, enhancing cloud computing capabilities, and spearheading the development of future technologies. Our advanced memory technologies are pivotal in powering today’s most sophisticated electronic devices and IT infrastructures, ensuring superior performance and user experiences across the digital realm.
We seek visionary thinkers to join our mission of redefining the technology landscape. At SK hynix America, you will collaborate with a team that is innovating groundbreaking memory solutions while upholding a strong commitment to sustainability. We are not merely adapting to technological advancements; we are the driving force behind them, with substantial investments in artificial intelligence, machine learning, and eco-conscious solutions and practices. As we continue to grow our market presence and push the limits of semiconductor technology, we invite you to be part of our journey in creating the next generation of memory solutions that will shape the future of computing.

Job Summary:

We are looking for a talented Advanced Package Design Engineer to become a part of our Packaging Engineering team at SK hynix America. In this role, you will be tasked with designing and optimizing high-performance, high-density interposers for chiplet-based architectures and heterogeneous integration solutions. You will work closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective packaging solutions.

Responsibilities:

  • Design silicon and organic interposers for advanced packaging solutions.
  • Utilize EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, and Siemens Xpedition to create and verify advanced package layouts.
  • Conduct design studies and 'what-if' scenario analyses for advanced packaging schemes to optimize overall package design.
  • Create and maintain layout design rules, stack-ups, and layout guidelines.
  • Collaborate with internal and external stakeholders to ensure seamless development of advanced packaging technologies.

About SK hynix America

SK hynix America is a trailblazer in semiconductor innovation, providing advanced memory solutions that enhance device performance and user experiences across various sectors. Committed to sustainability and technological advancement, we are shaping the future of computing through our cutting-edge memory technologies.

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